Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced the release of its much-anticipated Lepton 3.1R, the world’s first radiometric thermal camera module with a 95-degree field of view (FOV), 160 x 120 resolution, and a scene dynamic range of up to 400degrees Celsius. The 3.1R model maintains the same compact and low-power form factor that made the Lepton family of thermal camera modules the best-selling in the world for mobile, small electronics, and uncrewed systems. “The revolutionary Lepton was the world’s first thermal micro camera module integrated into millions of devices from ruggedized smartphones to drones,” said Mike Walters, vice president, product management, Teledyne FLIR.
“Lepton 3.1R can now propel advancements in cost-saving and lifesaving unattended products ranging from early fire monitoring of critical machinery, electrical switchgear, and data centers to IoT products for smart factory, occupancy monitoring, smart homes, smart appliances, and even elderly care applications.”
The Lepton 3.1R is a drop-in enhancement for existing Lepton-based products. It incorporates the same visual object and space perception interface (VoSPI), inter-integrated circuit (I2C), and electrical and mechanical form and fit as predecessor Leptons to simplify development. Furthermore, Lepton continues tobe the lowest-cost focal plane array (FPA) based thermal sensor on the market. Enhanced Thermal Radiometric Performance All Lepton modules include unmatched thermal sensitivity of <50 mK for an uncooled micro thermal camera. Lepton features many proprietary technologies, including wafer-level detector packaging, wafer-scale micro-optics, a custom application-specific integrated circuit (ASIC), and a low-cost, easy-to-integrate camera package. The Lepton family also includes integrated digital thermal image processing and radiometry, the ability to provide the temperature of every pixel in the scene.