• The new materials support 800 Gigabit Ethernet used for next-generation high-speed communication technology.
• They have achieved the industry's lowest (*1) transmission loss.

Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches.

The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of continuous social change toward the Internet of Everything (IoE) where all things will be connected through the Internet. The number of connected terminals and the volume of communication data is expected to increase significantly as IoE technology continues to evolve. In accordance with this trend, solutions for high-speed signal processing and increased power consumption have become major technical challenges.

High-speed communication networking equipment, the backbone of IoE technology, will now need to meet 800 GbE[3] (112 Gbps[4], PAM4[5]) targets, which are twice as fast as the current 400 GbE standards. As the electricity flowing through the conductors in printed circuit boards increases in speed and frequency, the transmission loss grows commensurately. This means new, high-performance circuit board materials with reduced transmission loss are required to ensure signal quality.

Panasonic leverages its proprietary resin design expertise and material compounding technologies to deliver both the excellent dielectric properties and the low transmission loss required for high-performance, high-layer-count circuit boards. Panasonic also incorporates both ultra-low dielectric dissipation factor glass cloth and low-profile copper foil[6] into MEGTRON 8.
Using these technologies, Panasonic has developed MEGTRON 8 Multi-Layer Circuit Board Materials featuring the Industry's Lowest (*1) Transmission Loss for this class of circuit board materials, thereby contributing to larger capacity and higher speed data communication. In addition, this product may reduce power consumption through lowering transmission loss (*2).

• (*1) As a high-layer-count circuit board material based on thermosetting resin as of January 18, 2022 (Panasonic data)
• (*2) In comparison with MEGTRON7 R-5785(N), the company's conventional material, when used in the same equipment under the same conditions

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